The process of re-flow soldering is utilized to produce a diverse range of electrical components. The most important step in this process is operating the tabletop reflow oven, which is consequently useful for creating DIY components as well. Home or commercial users never have any issues concerning their ovens since its bench top design provides an uncomplicated installation and application.
Reflow soldering is commonly used to attach surface mounted components to a circuit board. Less commonly, reflowing can also be used to attach through-hole components to the circuit boards. Solder paste (solder mixed with flux) is used to temporarily attach electrical components to a contact pad. This newly assembled contact pad and attached electrical components are then subject to heating in order to melt the solder, creating a permanent joint. This second step is where the use of this machine comes in.
Reflow ovens must be used so that the areas other than the paste aren't burnt or heated to the point of damage. The four specific features of the oven successfully targets the paste. These consist of preheat, soak, reflow, and cooling stages.
The oven begins at the preheat zone, which is often the lengthiest of the stages. During this stage, the temperature increases at a rate of between 1 and 3 degrees Celsius per second. This temperature change is referred to as the ramp-up rate. The controlled ramp-up rate is essential in avoiding thermal shock or cracking of the components.
The second stage after preheating is calling the thermal soak zone, which is about one to two minutes. Thermal soaking briefly stabilizes the paste and stimulates the fluxes. If the temperature is too high, the components may splatter or oxidize, so the oven is used to regulate a narrow range of heat. The range must be narrow because too low a temperature won't stimulate the fluxes enough.
Peak temperatures are reached in the re-flow zone. Temperatures in the oven goes as high as 20 to 40 degrees Celsius. There is a 20 degree difference in range because the specific degree depends on the lowest heat tolerance of the electric components. In order to bring about any damages, the oven will never heat up higher than 60 degrees.
Apart from the temperature itself, the required amount of time the oven stays in this stage to fully melt the paste relies on the TAL calculations, or time above liquidus. The component must stay in the reflow stage throughout the TAL, or else the paste might not melt fully and produce a dry and frail connection.
The cooling stage is the final step the re-flow oven performs. As the name suggests, this involves the gradual cooling of the board and newly attached components. This process is important in inhibiting the formation of excess intermetallic formations, as well as avoiding thermal shock. This is a short process because fast cooling rate creates the most mechanically sound structure. A commonly used cooling rate is around four degrees Celsius per second.
Reflow soldering is commonly used to attach surface mounted components to a circuit board. Less commonly, reflowing can also be used to attach through-hole components to the circuit boards. Solder paste (solder mixed with flux) is used to temporarily attach electrical components to a contact pad. This newly assembled contact pad and attached electrical components are then subject to heating in order to melt the solder, creating a permanent joint. This second step is where the use of this machine comes in.
Reflow ovens must be used so that the areas other than the paste aren't burnt or heated to the point of damage. The four specific features of the oven successfully targets the paste. These consist of preheat, soak, reflow, and cooling stages.
The oven begins at the preheat zone, which is often the lengthiest of the stages. During this stage, the temperature increases at a rate of between 1 and 3 degrees Celsius per second. This temperature change is referred to as the ramp-up rate. The controlled ramp-up rate is essential in avoiding thermal shock or cracking of the components.
The second stage after preheating is calling the thermal soak zone, which is about one to two minutes. Thermal soaking briefly stabilizes the paste and stimulates the fluxes. If the temperature is too high, the components may splatter or oxidize, so the oven is used to regulate a narrow range of heat. The range must be narrow because too low a temperature won't stimulate the fluxes enough.
Peak temperatures are reached in the re-flow zone. Temperatures in the oven goes as high as 20 to 40 degrees Celsius. There is a 20 degree difference in range because the specific degree depends on the lowest heat tolerance of the electric components. In order to bring about any damages, the oven will never heat up higher than 60 degrees.
Apart from the temperature itself, the required amount of time the oven stays in this stage to fully melt the paste relies on the TAL calculations, or time above liquidus. The component must stay in the reflow stage throughout the TAL, or else the paste might not melt fully and produce a dry and frail connection.
The cooling stage is the final step the re-flow oven performs. As the name suggests, this involves the gradual cooling of the board and newly attached components. This process is important in inhibiting the formation of excess intermetallic formations, as well as avoiding thermal shock. This is a short process because fast cooling rate creates the most mechanically sound structure. A commonly used cooling rate is around four degrees Celsius per second.
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